Industry:
Semiconductor Equipment & MaterialsLast Close:
628.25 USDExpected Dividend:
1.18 %Payoffs per Year:
4Ordering | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|
KLA-TENCOR USA | 1.05 | 1.94% 1.26% | 12.9% | 3.2% | 1.0 | 11.85 -14.83% | 31.56 | 15.7% | 11.11 | 1.0 |
SUMCO JPN | 1.0 | 1.5% 3.87% | 51.85% | 16.11% | 1.0 | 0.65 -57.51% | 15.8 | 0.0% | 66.27 | 2.0 |
TOKYO ELECTRON JPN | 0.59 | 0.86% 1.92% | 59.83% | 13.39% | 1.0 | 2.22 -70.38% | 70.56 | 5.29% | 71.1 | 3.0 |
ASML USA | 1.13 | 0.87% 0.2% | 33.04% | 3.79% | 1.0 | 6.47 -31.37% | 28.15 | 21.68% | 24.27 | 4.0 |
APPLIED MATERIALS USA | 1.12 | 1.61% 0.9% | 8.28% | 2.14% | 1.0 | 4.65 -38.12% | 19.16 | 10.04% | 45.63 | 5.0 |
LAM RESEARCH USA | 1.13 | 1.35% 1.18% | 15.09% | 2.47% | 1.0 | 5.9 -41.56% | 25.92 | 4.19% | 36.51 | 6.0 |
ADVANTEST JPN | 1.26 | 1.29% 0.8% | 12.5% | 2.09% | 1.0 | 1.98 -88.07% | 34.5 | 15.76% | 59.56 | 7.0 |
Dividend | Close | Div.-Yield | |
---|---|---|---|
Year | |||
2023 | 7.42 | 628.25 | 1.18 |
2022 | 6.45 | 420.30 | 1.53 |
2021 | 5.60 | 719.15 | 0.78 |
2020 | 4.90 | 472.27 | 1.04 |
2019 | 4.50 | 292.40 | 1.54 |
2018 | 3.80 | 135.42 | 2.81 |
2017 | 1.85 | 184.07 | 1.01 |
2016 | 1.35 | 105.73 | 1.28 |
2015 | 1.08 | 79.42 | 1.36 |
2014 | 0.54 | 79.34 | 0.68 |