Industry:
Semiconductor Equipment & MaterialsLast Close:
461.19 USDExpected Dividend:
1.26 %Payoffs per Year:
4Ordering | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|
KLA-TENCOR USA | 1.05 | 1.94% 1.26% | 12.9% | 3.2% | 1.0 | 11.85 -14.83% | 31.56 | 15.7% | 11.11 | 1.0 |
SUMCO JPN | 1.0 | 1.5% 3.87% | 51.85% | 16.11% | 1.0 | 0.65 -57.51% | 15.8 | 0.0% | 66.27 | 2.0 |
TOKYO ELECTRON JPN | 0.59 | 0.86% 1.92% | 59.83% | 13.39% | 1.0 | 2.22 -70.38% | 70.56 | 5.29% | 71.1 | 3.0 |
ASML USA | 1.13 | 0.87% 0.2% | 33.04% | 3.79% | 1.0 | 6.47 -31.37% | 28.15 | 21.68% | 24.27 | 4.0 |
APPLIED MATERIALS USA | 1.12 | 1.61% 0.9% | 8.28% | 2.14% | 1.0 | 4.65 -38.12% | 19.16 | 10.04% | 45.63 | 5.0 |
LAM RESEARCH USA | 1.13 | 1.35% 1.18% | 15.09% | 2.47% | 1.0 | 5.9 -41.56% | 25.92 | 4.19% | 36.51 | 6.0 |
ADVANTEST JPN | 1.26 | 1.29% 0.8% | 12.5% | 2.09% | 1.0 | 1.98 -88.07% | 34.5 | 15.76% | 59.56 | 7.0 |
Dividend | Close | Div.-Yield | |
---|---|---|---|
Year | |||
2023 | 5.82 | 461.19 | 1.26 |
2022 | 4.70 | 377.03 | 1.25 |
2021 | 3.90 | 430.11 | 0.91 |
2020 | 3.50 | 258.91 | 1.35 |
2019 | 3.10 | 178.17 | 1.74 |
2018 | 2.84 | 88.63 | 3.20 |
2017 | 2.26 | 105.07 | 2.15 |
2016 | 2.10 | 78.68 | 2.67 |
2015 | 2.04 | 69.35 | 2.94 |
2014 | 18.40 | 70.32 | 26.17 |
2013 | 1.70 | 64.46 | 2.64 |